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2w stereo audio power ampl ifier with shutdown AA4003 data sheet 1 oct. 2007 rev. 1. 1 bcd semiconductor manufacturing limited general description the AA4003 is a class ab stereo audio power ampli- fier which can deliver 2.0w into 4 speakers with lim- itation of thd+n less than 1%. the chip is designed specially for portable dv d player, portable media player, lcd monitor and di gital photo frame applica- tions. AA4003 is available in package of soic-16 and tssop-20 (edp). features output power, btl: 2.0w/ch (4 , thd+n 1%) se: 160mw/ch (16 , thd+n 1%) supply voltage range: 2.7v to 5.5v external feedback loop for flexible gain set-up low power consumption at shutdown mode 0.7 a typical se, btl mode switchable optimized click/pop noise suppression thermal shutdown protection applications portable dvd player portable media player lcd monitor digital photo frame figure 1. packages type of AA4003 tssop-20 (edp) soic-16
2w stereo audio power ampl ifier with shutdown AA4003 data sheet 2 oct. 2007 rev. 1. 1 bcd semiconductor manufacturing limited pin configuration g package ( tssop-20 (edp )) m package figure 2. pin configurations of AA4003 (top view) shutdown gnd outl+ vdd outl- lin- gnd lin+ hp-sense gnd outr+ vdd outr- rin- bypass rin+ shutdown gnd outl+ vdd outl- lin- gnd lin+ hp-sense gnd outr+ vdd outr- rin- bypass rin+ pgnd pgnd pgnd pgnd 1 2 19 18 12 9 13 8 7 6 14 15 17 16 5 4 3 11 10 20 1 2 15 14 9 8 7 6 10 11 13 12 5 4 3 16 (soic-16)
2w stereo audio power ampl ifier with shutdown AA4003 data sheet 3 oct. 2007 rev. 1. 1 bcd semiconductor manufacturing limited pin description pin number pin name function g package m package 1 1 shutdown shutdown mode en able pin, active high 2, 7, 19 2, 7, 15 gnd signal ground 3 3 outl+ left cha nnel positive output 4, 17 4, 13 vdd power supply pin 5 5 outl- left channel negative output 6 6 lin- left channel negative input 8 8 lin+ left channel positive input 9, 10, 11, 12 pgnd power ground, used for thermal release 13 9 rin+ right channel positive input 14 10 bypass internal reference voltage pin, connect a 1.0 f capacitor to gnd 15 11 rin- right channel negative input 16 12 outr- right channel negative output 18 14 outr+ right channel positive output 20 16 hp-sense se, btl mode switch pin, l C btl mode h C se mode
2w stereo audio power ampl ifier with shutdown AA4003 data sheet 4 oct. 2007 rev. 1. 1 bcd semiconductor manufacturing limited circuit type e1: lead free AA4003 - package temperature range part number marking id packing type tssop-20 (edp) -40 to 85 AA4003g-e1 AA4003g-e1 tube AA4003gtr-e1 AA4003g-e1 tape & reel soic-16 -40 to 85 AA4003m-e1 AA4003m-e1 tube AA4003mtr-e1 AA4003m-e1 tape & reel package g: tssop-20 (edp) tr: tape and reel blank: tube bcd semiconductor's pb-free pr oducts, as designated with "e1" suffix in the part number, are rohs compliant. m: soic-16 ordering information
2w stereo audio power ampl ifier with shutdown AA4003 data sheet 5 oct. 2007 rev. 1. 1 bcd semiconductor manufacturing limited absolute maximum ratings (note 1) note 1: stresses greater than those li sted under "absolute maximum ratings" may cause permanen t damage to the device. these are stress ratings only, and functi onal operation of the device at these or any other conditions be yond those indicated i n the operation is not implie d. exposure to "absolute maximum ratings" for extended periods may affe ct device reliability. note 2: chip is soldered to 200mm 2 copper (top side solder mask) of 1oz. on pcb with 8 x 0.5mm vias.. recommended operating conditions parameter symbol min max unit supply voltage v dd 2.7 5.5 v operating ambient temperature t a -40 85 o c parameter symbol value unit supply voltage v dd 6v input voltage v in -0.3 to v dd + 0.3 v power dissipation p d internally limited package thermal resistance r ja m package 90 o c/w g package 50 (note 2) operating junction temperature t j 150 o c storage temperature range t stg -65 to 150 o c lead temperature 1.6mm from case for 10 seconds t lead 260 o c esd (human body model) 2000 v esd (machine model) 300 v
2w stereo audio power ampl ifier with shutdown AA4003 data sheet 6 oct. 2007 rev. 1. 1 bcd semiconductor manufacturing limited (v dd =5v, t a =25 o c, c i =1 f, c out =220 f and r i =r f =20k unless otherwise sp ecified. for se mode, hp_sense=5v, p a r a m e t e r s y m b o l c o n d i t i o n s min ty p m a x u n i t quiescent current i dd se mode, v in =0, i o =0 310 ma btl mode, v in =0, i o =0 620 shutdown current i sd v shutdown =5v 0.7 2.0 a hp_sense logic v ih 4v v il 0.8 v shutdown logic v ih 3v v il 0.8 v thermal shutdown temperature 170 o c hysteresis temperature window 25 o c se mode output power p o thd+n=1%, r l =32 80 mw thd+n=10%, r l =32 110 thd+n=1%, r l =16 160 thd+n=10%, r l =16 220 total harmonic distortion + noise thd+n p o =75mw, r l =32 , 0.2 % signal to noise ratio snr p o =75mw, r l =32 , 90 db crosstalk x talk p o =75mw, r l =32 , f=1khz -80 db power supply rejection ratio psrr c b =1 f, f=1khz, v ripple =0.2vrms, r l =16 60 db btl mode output offset voltage v os v in =0v, no load 5 50 mv output power p o thd+n=1%, r l =4 2 w thd+n=10%, r l =4 2.5 thd+n=1%, r l =8 1.1 thd+n=10%, r l =8 1.5 total harmonic distortion + noise thd+n p o =1w, r l =4 , 0.1 % signal to noise ratio snr p o =1w, r l =8 , 95 db crosstalk x talk p o =1w, r l =8 , f=1khz -80 db power supply rejection ratio psrr c b =1 f, f=1khz, v ripple =0.2vrms, r l =8 67 db electrical characteristics for btl mode, hp_sense=0v. )
2w stereo audio power ampl ifier with shutdown AA4003 data sheet 7 oct. 2007 rev. 1. 1 bcd semiconductor manufacturing limited typical performance characteristics figure 3. quiescent current vs. supply voltage figure 4. quiescent current vs. ambient temperature figure 5. thd+n vs. output power figure 6. thd+n vs. output power 10m 100m 1e-3 0.01 0.1 1 10 300m thd+n (%) output power (w) v dd =5.0v, se mode f=1khz, lpf=30khz r l =16 r l =32 @ se mode @ btl mode 10m 100m 1 0.01 0.1 1 10 3 thd+n (%) output power (w) v dd =5.0v, btl mode f=1khz lpf=30khz r l =4 r l =8
2w stereo audio power ampl ifier with shutdown AA4003 data sheet 8 oct. 2007 rev. 1. 1 bcd semiconductor manufacturing limited typical performance characteristics figure 7. thd+n vs. output power figure 8. thd+n vs. output power figure 9. thd+n vs. frequency @ se mode figure 10. thd+n vs. frequency @ btl mode @ se mode @ btl mode 100 1k 10k 0.01 0.1 1 10 20k 20 thd+n (%) frequency (hz) btl mode, v dd =5.0v p o =1w, r l =8 lpf=80khz 100 1k 10k 0.01 0.1 1 10 20k 20 thd+n (%) frequency (hz) se mode, v dd =5.0v p o =75mw, r l =32 lpf=80khz, c out =1000 f 100 1k 10k 0.01 0.1 1 10 20 20k thd+n (%) frequency (hz) v dd =5.0v, btl mode p o =1.5w, r l =4 lpf=80khz 100 1k 10k 0.01 0.1 1 10 20 20k thd+n (%) frequency (hz) v dd =5.0v, se mode c out =1000 f, p o =150mw r l =16 , lpf=80khz
2w stereo audio power ampl ifier with shutdown AA4003 data sheet 9 oct. 2007 rev. 1. 1 bcd semiconductor manufacturing limited typical performance ch aracteristics (continued) figure 11. output power vs. resistor load 0 10203040506070 200 400 600 800 v dd =5.0v, se mode f=1khz, lpf=30khz thd+n=10% thd+n=1% output power (mw) resistor load (ohm) @ se mode figure 12. output power vs. resistor load 0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 0.0 0.5 1.0 1.5 2.0 2.5 v dd =5.0v, btl mode f=1khz, lpf=30khz thd+n=10% thd+n=1% output power (w) resistor load ( ) @ btl mode figure 13. output power vs. supply voltage @ se mode figure 14. output power vs. supply voltage 2.5 3.0 3.5 4.0 4.5 5.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 btl mode, r l =4 f=1khz, lpf=30khz thd+n=10% thd+n=1% output power (mw) supply voltage (v) @ btl mode 2.5 3.0 3.5 4.0 4.5 5.0 0 50 100 150 200 250 se mode, r l =16 f=1khz, lpf=30khz thd+n=10% thd+n=1% output power (mw) supply voltage (v)
2w stereo audio power ampl ifier with shutdown AA4003 data sheet 10 oct. 2007 rev. 1. 1 bcd semiconductor manufacturing limited typical performance ch aracteristics (continued) figure 15. psrr vs. frequency figure 16. psrr vs. frequency figure 17. start-up time vs. bypass capacitor figure 18. closed loop frequency response 10 100 1k 10k 100k 1m 10m -20 -16 -12 -8 -4 0 4 -280 -240 -200 -160 -120 -80 se mode, v dd =5.0v r f =r i =20k, c out =1000 f phase phase (deg) gain (db) frequency (hz) gain 0.20.40.60.81.0 0 200 400 600 800 1000 v dd =5.0v start-up time (ms) bypass capacitor ( f) @ se mode @ btl mode 10 100 1k 10k 40 45 50 55 60 65 70 75 20k v dd =5.0v, btl mode r l =8 , c b =1.0 f v ripple =0.2vrms psrr (db) frequency (hz) 10 100 1k 10k 10 20 30 40 50 60 70 20k psrr (db) frequency (hz) v dd =5.0v, se mode r l =32 ,cb=1.0 f v ripple =0.2vrms
2w stereo audio power ampl ifier with shutdown AA4003 data sheet 11 oct. 2007 rev. 1. 1 bcd semiconductor manufacturing limited application information se/btl mode, hp_sense pin the AA4003 can operate under 2 types of output configuration, btl (bridged-tied-load) mode and se (single-ended) mode, determined by hp_sense pin's logic level. (here is the discussion about left channel only, it equally applies to right channel.) when hp_sense pin is held low which sets the chip in btl mode, the amp2l unit is turned on. amp2l has fixed unity gain internally, ac signal at out+ is 180 degree phase shifted from out-. because the dc component (output bias voltage, approx 1/2 v dd ) between out+ and out- is canceled, there is no necessity to use dc block capacitors for main speak. in btl mode, output voltage swing across main speaker is about 2 times that in se mode, so there is 4 times output power compared to se mode with same load and input. (see figure 19) if applying high level to hp_sense pin which sets the chip in se mode, the amp2l unit is in high impedance state. there is no current loop between out+ and out-, the main speak is naturally disabled without any hardware change. the output audio signal rides on bias voltage at out- (output bias voltage, approx 1/2 v dd ) , so it has to use a capacitor c out to block dc bias and couple ac signal to headphone speak. (see figure 20) it is recommended to c onnect hp_sense to the headphone jack switch pin illustrated in figure 19. when headphone plug is not inserted, the voltage of hp_sense pin is determined by voltage divider formed by r1 and r pd . for given resistor's value in figure 19, r1=100k , r pd =1.5k , dc voltage at hp_sense is about 74mv. ac signal equals output amplitude of out- through c out , so signal at hp_sense node is 74mv dc plus ac signal. the maximum peak-to-peak volta ge at out- is no greater than v dd (supply voltage 5.0v), so the positive maximum voltage of hp_sense node will be no greater than 2.5v+75mv 2.575v, which is less than hp_sense input high level minimum value (4.0v). that means the chip is in btl mode and there is no risk of operation mode switch between se and btl. when headphone plug is inserted, as the r pd is disconnected from r1, the voltage of hp_sense pin is pulled up by r1 to v dd and sets the chip in se mode. hp_sense pin can also be connected to mcu i/o port to control the mode switch through mcu. it is necessary to note that AA4003 still can drive headphone even in btl mo de because out- is always active whatever the chip is in se or btl mode. c in , c out , cb and c s (power supply) selection for input stages of AA4003, input capacitors c i is used to accommodate different dc level between input source and AA4003 bias voltage (about 2.31v). input capacitors c i and input resistors r i form a first order high pass filter, which determines the lower corner frequency according to the classic equation below, figure 19. output configuration for left channel in btl mode figure 20. output configuration for left channel in se mode 20k 20k left out- left out+ + _ + _ + c out 220 f r pd 1.5k amp1l amp2l sleeve headphone jack r2 100k hp_sense= low level r1 100k v dd main speak 20k 20k left out- left out+ + _ + _ + c out 220 f amp1l amp2l r2 100k r1 100k v dd headphone speak main speak hp_sense= high level r pd 1.5k
2w stereo audio power ampl ifier with shutdown AA4003 data sheet 12 oct. 2007 rev. 1. 1 bcd semiconductor manufacturing limited application information (continued) .............................................(1) similarly, for output stage in se mode, output capacitor (c out ), and headphone load also form a first order high pass filters, and its cut-off frequency is determined by equation 2. ......................................(2) the purpose of bypass capacitor (cb) is to filter internal noise, reduce harmonic distortion, and improve power supply rejection ratio performance. tantalum or ceramic capacitor with low esr is recommended, and it should be placed as close as possible to the chip in pcb layout. the chip will not work until internal dc bias is set up completely. so the size of cb will also affect the chip start up time, which is approx linearly proportional to the value of bypass capacitor. for AA4003, here are various start-up times for several typical capacitor values. (see figure 17) for AA4003 power supply, it is better to use an individual power source generated from voltage regulator split from video, digital circuit units in system. the power supply bypass capacitors, c s , is recommended to use one low esr electrolytic capacitor between 4.7 f to 10 f with a parallel 0.1 f ceramic capacitor which is located close to the chip. setup proper gain, design example the closed loop gain of AA4003 is determined by the ratio of feedback resistor (r f ) to input resistor (r i ). ........................................................(3) example: v dd =5v, r l =8 , btl configuration, desired output power p o =1.0w (each channel), thd+n 1%. input signal, v in =1.0vrms from d-a converter. step 1, to check if the chip can deliver 1w to 8 load with the limitation of thd+n 1%, v dd =5v. from figure 6, figure 12, AA4003 can deliver 1w to 8 load each channel. step 2, if yes, to calculate output voltage, so pass-band gain, av=v out /v in =2.83x. step 3, assuming input resistor is 20k , the feedback resistor=20k *1.415=28.3k .. select the closest standard value 28k . shutdown AA4003 has a shutdown feature to reduce power consumption. if apply high level to shutdown pin, output amplifiers will be turned off, bias circuit is also disabled, the maximum current drawn from v dd is less than 2.0 a. a logic low level will enable the device. optimizing click/pop noise the AA4003 includes optimized circuits to suppress click/pop noise during power up/power down transition. in btl mode the AA4003 can effectively reduce most common mode signal including click/pop noise. in se mode, optimized ramp for rise/fall edge of bias can significantly reduce click/pop noise due to charge and/or discharge output capacitor (c out ). furthermore, increasing by pass capacitor value (cb) can slower ramp of charging bypass capacitor, prolong start-up time, mask most of transient noises before bias voltage is set up completely. it is recommended to use 1.0 f capacitor with lower esr. cb ( f) start up time (ms) 0.33 340 0.47 420 1.0 970 i f v r r a = rms l o out v r p v 83 . 2 8 * 1 = = ? = out hp col c r f ? = 2 1 i i cil c r f ? = 2 1
2w stereo audio power ampl ifier with shutdown AA4003 data sheet 13 oct. 2007 rev. 1. 1 bcd semiconductor manufacturing limited application information (continued) power dissipation , efficiency and thermal design consideration for class ab amplifiers, formula 4 is the basic equation of efficiency work ed in btl configuration, .......................................................(4) here v p is output peak voltage across the load. thermal dissipation becomes major concern when delivering more output power especially in btl mode. the maximum power dissipation can be calculated by following equation. ......................................(5) here t jmax is maximum operating junction temperature, 150 o c , t a is ambient temperature, ja is thermal resistance from junction to ambient, which is 50 o c /w for tssop-20 (edp), given in datasheet. assuming t a is 25 o c , the maximum power dissipation p dmax is about 2.5w according to formula 6. there is an other formula about power dissipation which is determined by supply voltage and load resistance. ......................................(6) if power dissipation calculated in an application is larger than that package perm itted, there will be a need to assemble an additional heat sink, or keep ambient temperature around the chip low, or increase load resistance, or decrease power supply voltage. here is an example. assuming v dd =5.0v, r l =4 , stereo in btl mode, per channel, total power dissipation p dtotal =2* p dbtlmax =2.53w. according to formula 6, maximum ambient temperature is, =150-50*2.53=23.5 o c that is to say, if user wants AA4003 to delivery 2w power per channel to 4 load at v dd =5.0v, btl mode, ambient temperatur e has to hold lower than 23.5 o c . when junction temperature exceeds about 170 o c , otsd feature will be enabled, and shutdown the device to limit total power dissipation. there is an exposed thermal pad on bottom of the chip to provide the direct thermal path from die to heat sink. it is recommended to use copper on the surface of printed circuit board as heat sink. to dig some matrix regular holes under chip, remove mask of this area copper, and make sure to k eep them contact well when soldering on pcb are also recommended. (see figure 21) recommended pcb layout for AA4003 using wide traces for powe r supply to reduce power losses caused by parasitic resistance in all outputs is useful to help releasing heat away from the chip. it is recommended to place bypass capacitor, power supply bypass capacitors as close as possible to the chip. figure 21 and figure 22 show the recommended layout for double layer pcb. dd p v v 4 = ja a jmax dmax t t p ? = l dd dbtlmax r v p 2 2 2 = w r v p l dd dbtlmax 266 . 1 4 14 . 3 5 2 2 2 2 2 2 = = = dbtlmax ja jmax a p t t ? ? =
2w stereo audio power ampl ifier with shutdown AA4003 data sheet 14 oct. 2007 rev. 1. 1 bcd semiconductor manufacturing limited application information (continued) figure 21. copper and holes under part figure 22. top route and silk screens
2w stereo audio power ampl ifier with shutdown AA4003 data sheet 15 oct. 2007 rev. 1. 1 bcd semiconductor manufacturing limited typical application figure 23. typical application circuit of AA4003 (m package) 20k 20k 20k 20k outl- outl+ + _ + _ 5 3 + c out 220 f 1.5k amp1l amp2l to hp-sense circuit sleeve headphone jack 20k 20k 20k 20k outr- outr+ + _ + _ 12 14 + c out 220 f 1.5k amp1r amp2r v dd + c s 10 f left in 1uf + 1.0 f + 100k 100k 1 f right in + to control pin 6 16 10 bypass 8 11 2,7,15 4,13 1 shutdown hp-sense lin- lin+ rin- rin+ 9 r f r i r f r i c i c i r pd r pd cb v dd
2w stereo audio power ampl ifier with shutdown AA4003 data sheet 16 oct. 2007 rev. 1. 1 bcd semiconductor manufacturing limited tssop-20(edp) unit: mm(inch) mechanical dimensions 0.650(0.026)typ 6.200(0.244) 6.600(0.260) #1 pin 6.400(0.252) 6.600(0.260) index 0.750(0.030) 0.850(0.033) dp 0.000(0.000) 0.100(0.004) 2.900(0.114) 3.100(0.122) 4.100(0.161) 4.300(0.169) 0.200(0.008) 0.280(0.011) 0.050(0.002) 0.150(0.006) 0.900(0.035) 1.050(0.041) 1.200(0.047) max 0.340(0.013) 0.540(0.021) 10 14 0.250(0.010)typ 0.450(0.018) 0.750(0.030) 1.000(0.039) ref 0 8 r0.090(0.004)min r0.090(0.004)min top & bottom 4- 0.200(0.008)min 4.300(0.169) 4.500(0.177) 0.100(0.004) 0.190(0.007) exposed pad
2w stereo audio power ampl ifier with shutdown AA4003 data sheet 17 oct. 2007 rev. 1. 1 bcd semiconductor manufacturing limited mechanical dimens ions (continued) soic-16 unit: mm(inch) 7 1 0 . 0 0 0 ( 0 . 3 9 4 ) 6.040(0.238) 0.406(0.016) 20:1 a 1.650(0.065) 0.700(0.028) 7 1 5 b c 1 . 0 0 0 ( 0 . 0 3 9 ) s 1.000(0.039) 0.200(0.008) 20:1 b c 50:1 c-c 0 . 2 5 0 ( 0 . 0 1 0 ) 0 . 2 0 0 ( 0 . 0 0 8 ) m i n 0.500(0.020) 0.600(0.024) 0 . 2 5 0 ( 0 . 0 1 0 ) depth 0.060(0.002) 0.100(0.004) 2.000(0.079) 1 . 3 0 0 ( 0 . 0 5 1 ) 1.000(0.039) 1.270(0.050) depth 0.200(0.008) 0 . 2 5 0 ( 0 . 0 1 0 ) 0 . 1 5 0 ( 0 . 0 0 6 ) r0.200(0.008) r0.200(0.008) 0 . 2 0 3 ( 0 . 0 0 8 ) a 3.940(0.155) 3 8 9 . 5 8 8 7 0.400(0.016) 45
important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd., shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen, 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corp. 30920 huntwood ave. hayward, ca 94544, usa tel : +1-510-324-2988 fax: +1-510-324-2788 - headquarters bcd semiconductor manufacturing limited no. 1600, zi xing road, shanghai zizhu sc ience-based industrial park, 200241, china tel: +86-21-24162266, fax: +86-21-24162277 bcd semiconductor manufacturing limited important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited

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